39199020 -- Self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers
85042100 -- Having a power handling capacity not exceeding 650?kVA
84564000 - Operated by plasma arc processes
85015381 ---- Exceeding 75?kW but not exceeding 375?kW
38122010 -- Reaction mixture containing benzyl 3-isobutyryloxy-1-isopropyl-2,2-dimethylpropyl phthalate and benzyl 3-isobutyryloxy-2,2,4-trimethylpentyl phthalate